Quantum Photonic Integrated Circuits and Packaging
Apr 2, 2026 11:00 am
HMNTL 1000
- Sponsor
- Micro and Nanotechnology Laboratory
- Speaker
- Professor Stefan Preble
- Contact
- Can Bayram
- cbayram@illinois.edu
- Title: Quantum Photonic Integrated Circuits and Packaging
Abstract: Quantum Photonic Integrated Circuits are a key platform for scalable quantum technologies, integrating photon sources, photonic circuits, and interconnects on a single chip. This talk will highlight core enabling components, including integrated photon sources from the visible to telecom bands and their use in metro‑scale quantum networking demonstrations. I will discuss heterogeneous integration and packaging approaches (incorporating lasers and nonlinear materials), enabled by techniques including micro‑transfer printing and photonic wire bonding, which are paving the way toward deployable distributed quantum systems.
Bio: Stefan Preble is the Bausch and Lomb Professor and Director of Microsystems Engineering at the Rochester Institute of Technology (RIT). His research is focused on the development of Photonic Integrated Circuits for high performance computing, communication and sensing applications. He received a B.S. from RIT in Electrical Engineering (2002), and Ph.D. in Electrical & Computer Engineering from Cornell University (2007). He leads education initiatives for AIM Photonics, including, the online course, “Photonic Integrated Circuits 1” which has trained thousands on PIC design; he also leads AIM Photonics Testing & Packaging workshops and Hands-on Photonic Education Kits (HOPE) kits.