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Mechanics of Soft/Flexible Materials for Bio & Chip Technologies

Event Type
Seminar/Symposium
Sponsor
Mechanical Science and Engineering
Location
4100 Sidney Lu Mechanical Engineering Building
Date
Sep 17, 2024   4:00 pm  
Speaker
Professor Kyung-Suk Kim, Professor of Engineering, Brown University
Contact
Amy Rumsey
E-Mail
rumsey@illinois.edu
Phone
217-300-4310
Views
138
Originating Calendar
MechSE Seminars

Abstract

The presentation will delve into the recent strides made in engineering soft and flexible materials, showcasing their applications in biomechanical sensing across various scales and advanced chip integration technologies. The engineering process is rooted in the mechanics of deformation instabilities in these materials, coupled with the evolutionary post-bifurcation configurations. Notably, the materials of interest encompass nearly hyperelastic solids, alongside single- and multi-layer graphene. Furthermore, novel solutions for deformation instabilities have been uncovered, including the inherent hyperelastic crease and cusp singularities, as well as flexoelectric curvature localization in multilayer graphene. The presentation will also explore the potential implications of these solutions in the realm of self-assembling nanoparticles for bio and quantum devices.

About the Speaker

Kyung-Suk Kim has 44 years of experience as an engineering science faculty and is currently a Professor of Engineering at Brown University, the executive committee representative of the solid mechanics group at Brown, directing the Nano and Micro Mechanics Laboratory. He received a Ph.D. ('80) in Solid Mechanics from Brown University and had postdoctoral training at Caltech ('79-'80). He taught at the TAM Department, University of Illinois, Urbana-Champaign, for nine years until he joined Brown as a Professor of Engineering in 1989. He also held visiting faculty positions at Harvard University ('87-'88 and 2002), Cambridge University, U.K. ('96), University of California, Santa Barbara ('97), Distinguished Visiting Scientist at KIST ('08), and Simpson Visiting Faculty Fellow ('13) at Northwestern University. He is a John Simon Guggenheim Fellow ('96) and has advised more than 40 Ph.D. students and postdocs. He received the Ho-Am Prize in Engineering in 2005, the Engineering Science Medal from the Society of Engineering Science in 2012, the Drucker Medal from the American Society of Mechanical Engineers in 2016, and delivered the Society of Experimental Mechanics' William M. Murray Lecture, the society's highest honor, in 2019. His early contributions include research advancements in dynamic plasticity, adhesion science, nonlinear fracture, nanotribology, and solid-surface mechanics.  

Host: Professor Nikhil Admal 

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