Abstract
Recent advances in heterogeneous integration and advanced packaging technology have enabled the combination of multiple functionalities into a single system. Among various, monolithic 3D integration of functional crystalline membranes, such as III-V, III-N, complex oxides and 2D materials has shown great potential to be integrated on both the front and back-sides of Si CMOS circuitry. The Integration of sensors, power delivery network and high bandwidth memory with CMOS computing units through 3D packaging technology attracts significant interest, especially for on-device AI applications. This advanced integration not only enhances computational capabilities but also opens up new possibilities in edge intelligence. Here, I will discuss how this cutting-edge technology revolutionizing edge intelligence, driving advancements in biomedical devices and robotics applications.
Biography
Kyusang Lee is currently an Associate Professor of Electrical and Computer Engineering and Materials Science and Engineering departments at University of Virginia. He received his B.S. degree from Korea University in 2005, M.S. degree from Johns Hopkins University in 2009, and Ph.D. degree from University of Michigan in 2014, all in Electrical Engineering. He was a postdoctoral fellow in the Department of Electrical Engineering and Computer Science at the University of Michigan, and a postdoctoral associate in the Department of Mechanical Engineering at Massachusetts Institute of Technology (MIT). His research interests highlight the use of thin-film compound semiconductors for monolithic 3D integration with Si CMOS circuits through advanced packaging techniques, with a particular emphasis on applications for edge intelligence in biomedical and robotics applications. He is the recipient of the NSF faculty early career award and AFOSR young investor program award.
