Panel Discussion on Advances in Additive Manufacturing for Heat Transfer Applications
Mar 17, 2021 9:00 am 10:30
- Sponsor
- MIT Department of Mechanical Engineering
- Speaker
- Bill King, University of Illinois Urbana-Champaign, Jae Sung Son, Ulsan National Institute of Science and Technology (North Korea), Ole Sigmund Technical University of Denmark, Saniya LeBlanc (moderator) The George Washington University
- Views
- 49
- Originating Calendar
- MechSE Seminars
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This MIT Innotherm Colloquium focuses on heat transfer applications of additive manufacturing, which enables new device geometries, systems architectures, and materials. These innovations offer the potential to impact heat transfer performance, system compactness, and energy efficiency.
https://meche.mit.edu/international-colloquia-thermal-innovations