Heterogeneous Materials Integration for Photonic Integrated Circuits

Abstract
Wafer-bonding is a key enabling technology for the development of complex photonic integrated circuits (PICs) that utilize the best properties of various materials. III-V semiconductors are especially important for such PICs because they offer a wide variety of bandgaps, very high gain under electrical injection, large optical nonlinearity, and wide transparency regions. I will describe some of the projects done by the Quantum Nanophotonics Group at NIST/Boulder over the past several years that utilize wafer-bonding to make novel optoelectronic devices, ranging from dispersion engineered waveguides in the mid-wave IR region of the spectrum to the demonstration of integrated semiconductor lasers at wavelengths less than 1000 nm

Bio
Prof. Richard Mirin completed his PhD on quantum dot lasers in the ECE Dept at UC Santa Barbara under the supervision of Prof. John Bowers. He worked at
the National Institute of Standards and Technology (NIST) in Boulder, CO from 1996 until he returned to UCSB as an ECE professor in January 2026.