Photonic Interface for Smart Packaging Technical Interchange Meeting (TIM)
Apr 10, 2024 1:00 - 2:00 pm
- Sponsor
- Advanced Semiconductor Chips with Accelerated Performance (ASAP)
- Views
- 42
If you are interested in participating in the mentorship call between industry sponsor Intel and the project's researchers, contact Mallory Gorman (magorma2@illinois.edu) for the Zoom link.