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Photonic Interface for Smart Packaging Technical Interchange Meeting (TIM)

Event Type
Meeting
Sponsor
Advanced Semiconductor Chips with Accelerated Performance (ASAP)
Date
Apr 10, 2024   1:00 - 2:00 pm  
Views
8

If you are interested in participating in the mentorship call between industry sponsor Intel and the project's researchers, contact Mallory Gorman (magorma2@illinois.edu) for the Zoom link.

link for robots only