Photonic Interface for Smart Packaging Technical Interchange Meeting (TIM)
- Event Type
- Meeting
- Sponsor
- Advanced Semiconductor Chips with Accelerated Performance (ASAP)
- Date
- Apr 10, 2024 1:00 - 2:00 pm
- Views
- 41
If you are interested in participating in the mentorship call between industry sponsor Intel and the project's researchers, contact Mallory Gorman (magorma2@illinois.edu) for the Zoom link.