Abstract:
The promise of silicon integrated circuits with their electronic or photonic functionality enhanced via heterogeneous integration has motivated significant work in understanding and overcoming the barriers to realizing such an IC. High-speed electronic devices, devices with high breakdown voltages, light emitting/detecting devices, and devices for photon control could all be integrated with conventional CMOS to perform specialized electronic or photonic functions if suitable methods for forming such heterogeneously integrated regions were available. Technical challenges include lattice mismatch, thermal expansion coefficient differences, having the capability to form low-resistance electrical contacts using materials that are compatible with CMOS, managing cross-contamination in tools used for front-end-of-line processing after III-V regions are established on the silicon wafers, and thermal management for the heterogeneously integrated devices or circuits. In this talk, various approaches for heterogeneous integration will be reviewed, challenges will be discussed, and more recent methods and results will be presented.
Bio:
John Dallesasse is a Professor of Electrical and Computer Engineering and Associate Dean in the Grainger College of Engineering at the University of Illinois at Urbana-Champaign (UIUC), where he’s been for over 12 years. He also has over 20 years of industry experience in technology development and executive management, having led technically diverse and geographically distributed engineering teams. Prior to joining UIUC he was the Chief Technology Officer, Vice President, and co-founder of Skorpios Technologies where he was responsible for developing innovative methods for heterogeneous integration of compound semiconductors with silicon. His technical contributions include, with Nick Holonyak, Jr., the discovery of III‑V Oxidation, which has become an enabling process technology for the fabrication of Vertical-Cavity Surface-Emitting Lasers (VCSELs) for optical networking, 3D imaging, and LIDAR applications. His research group at UIUC works on novel methods for heterogeneous integration using epitaxial transfer which have been applied to the fabrication of VCSELs and other photonic devices on silicon, on mode control methods which have been used to provide record single-mode powers on conventional VCSEL structures, and on mid-IR emitters using quantum cascade structures within a transistor structure. John has over 100 publications and conference presentations, and 51 issued patents. He serves or has served as the Chair of the Steering Committee for the IEEE Journal of Lightwave Technology, the Chair of the Steering Committee for the IEEE Transactions on Semiconductor Manufacturing, as the Vice President of Technical Committees for IEEE-EDS, and as the Vice President of Strategic Directions for IEEE-EDS. He is a Fellow of the IEEE and Optica.