Invited Lecture: Quantum Photonic Integrated Circuits and Packaging
Apr 2, 2026 11:00 am
Holonyak Micro and Nanotechnology Laboratory (HMNTL), Room 1000, Auditorium

- Sponsor
- Holonyak Micro and Nanotechnology Laboratory (HMNTL)
- Speaker
- Prof. Stefan Preble, Rochester Institute of Technology (RIT)
- Cost
- Free & Open to All
- Contact
- Prof. Can Bayram
- cbayram@illinois.edu
- Phone
- 217-300-0978
- Views
- 2
- Originating Calendar
- Illinois ECE Calendar
April 2nd, Thursday, at 11 am in HMNTL 1000
Title: Quantum Photonic Integrated Circuits and Packaging
Abstract: Quantum Photonic Integrated Circuits are a key platform for scalable quantum technologies, integrating photon sources, photonic circuits, and interconnects on a single chip. This talk will highlight core enabling components, including integrated photon sources from the visible to telecom bands and their use in metro‑scale quantum networking demonstrations. I will discuss heterogeneous integration and packaging approaches (incorporating lasers and nonlinear materials), enabled by techniques including micro‑transfer printing and photonic wire bonding, which are paving the way toward deployable distributed quantum systems.Biography: Stefan Preble is the Bausch and Lomb Professor and Director of Microsystems Engineering at the Rochester Institute of Technology (RIT). His research is focused on the development of Photonic Integrated Circuits for high performance computing, communication and sensing applications. He received a B.S. from RIT in Electrical Engineering (2002), and Ph.D. in Electrical & Computer Engineering from Cornell University (2007). He leads education initiatives for AIM Photonics, including, the online course, “Photonic Integrated Circuits 1” which has trained thousands on PIC design; he also leads AIM Photonics Testing & Packaging workshops and Hands-on Photonic Education Kits (HOPE) kits.