Grand Challenges in RF & Plasma For Next Generation Deposition Processes in Semiconductor Manufacturing
Abstract: The semiconductor industry is experiencing rapid growth, driven by the explosive advancements in AI, machine learning, and quantum computing. As one of the largest industrial segments globally, the semiconductor industry leverages the unique capabilities of RF and plasma technologies. These technologies have been pivotal in propelling the industry's recent evolution. To sustain this momentum, the industry requires innovative, ambitious, and talented young professionals. In this seminar, we will introduce the fabrication processes in the semiconductor industry, with a focus on RF and plasma technology. We will then review the cutting-edge technology at Lam Research and discuss the major challenges we face in RF and plasma area for PECVD and PEALD processes.
Bio: Matthew Szott is a Plasma Physicist at Lam Research Corporation. He received his Ph.D. in Nuclear, Plasma, and Radiological Engineering from UIUC in 2020, working with Professor David Ruzic on liquid lithium solutions for fusion devices. He began his post-graduate career in the Lam Research CoRE rotation program, working with both experimental and modeling groups in PECVD, dielectric etch, and electrochemical deposition. He is currently working in the Source Development team of the Deposition Product Group, designing and implementing new diagnostics and plasma sources for a wide range of device applications.