Advancements in Chiplet & Advanced Packaging Technology are being leveraged to drive next generation systems solutions. These advancements can include co-packaged optics (CPO) technology targeted for artificial intelligence (AI) High Performance Computing (HPC) system adoption. The CPO expected benefits include higher AI system performance with reduced time and improved energy efficiencies for AI training and AI inference. CPO photonic models, simulations and hardware have demonstrated higher bandwidth density, low insertion loss, compatibility with lead free solder reflow and compatibility with JEDEC reliability stress testing. Demonstrated optical link module hardware and continuing hardware advancements permit bandwidth density scaling from 4 to 8 optical links per millimeter on photonic integrated circuit (PIC) chips to 20 to 50+ optical links per millimeter of chip edge. Compatibility with wavelength division multiplexing support multiple lambda per optical channel to compliment physical density scaling. In addition, optical channel scaling per module while maintaining compatibility with pluggable connector industry standards permit overall on and off module photonic chip to chip scaling by orders of magnitude. CPO technology advancements from research laboratory to prototyping and manufacturing leverage co-design, modeling and simulations through hardware build, integration and characterization. New designs, materials, structures and process improvements were made leveraging hardware characterization data and updates to digital models. Figure 1 below shows an expanded view and integrated optical test module designed and demonstrated in this research. A roadmap of next generation of research advancements capture client application form factors with current research product design kits (PDK) / assembly design kits (ADK) and position for next generations of more energy efficient, higher density CPO solutions. Our expanding ecosystem of suppliers, clients and partners using IBM CPO prototyping and manufacturing advancements target continued system adoption and growth for differentiation in targeted AI system applications.