High-performance semiconducting films with precisely engineered thicknesses and compositions are essential for developing next generation electronic devices, which are becoming more integrated, complex, and multifunctional. My talk will introduce the novel processes that enable atomic-scale control of the thickness and spatial composition of semiconducting films on the wafer-scale. These processes include: (i) the wafer-scale generation of monolayer van der Waals semiconductors such as transition metal dichalcogenides (TMDs) via metal-organic chemical vapor deposition (MOCVD), (ii) the atomic-level engineering of vertical thickness and composition through the layer-by-layer assembly of TMD monolayers, and (iii) the transfer of atomically engineered films, using their van der Waals nature, onto arbitrary substrates. These capabilities provide a new material platform for both fundamental research and practical applications, including incorporation into existing integrated circuit technology to form hybrid materials (i.e. TMD/CMOS) and boost electrical and optical functionality.
About the Speaker
Dr. Kibum Kang is a Postdoctoral Associate in the Department of Chemistry at the University of Chicago, and will join the Korea Advanced Institute of Science and Technology (KAIST) Department of Materials Science and Engineering as an assistant professor at the end of this year. His research focuses on the growth/assembly of van der Waals semiconductors for optoelectronics applications. His recent works have been published in Nature (2015) and Nature (accepted 2017). Kibum earned a B.S. and a PhD in Materials Science and Engineering (MSE) from Pohang University of Science Technology (POSTECH) in South Korea. He won the Best PhD Thesis award from the MSE department in 2012.
1) K. Kang, S. Xie, L. Huang, Y. Han, P. Y. Huang, K. F. Mak, C.-J. Kim, D. A. Muller, J. Park, “High-mobility three-atom-thick semiconducting films with wafer scale homogeneity”, Nature 520, 656 (2015).
2) K. Kang, K.-H. Lee, Y. Han, H. Gao, S. Xie, D. A. Muller, J. Park, “Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures”, Nature, In Press (2017).
Host: Professor SungWoo Nam